Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography

IEEE transactions on components, packaging, and manufacturing technology. Part A

Volumn 18, Issue 4, 1995, Pages 851-861

  Rooks, S M ^a   Benhabib, B ^a   Smith, K C ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; ARRAYS; INSPECTION; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; X RAY ANALYSIS;

BALL GRID ARRAY (BGA) JOINTS; INSPECTION ALGORITHM; SCANNED BEAM X RAY LAMINOGRAPHY;

ELECTRONICS PACKAGING;

EID: 0029546357     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.477473     Document Type: Article

References (15)