Modelling of transient liquid phase bonding

International Materials Reviews

Volumn 40, Issue 5, 1995, Pages 181-196

  Zhou, Y ^a   Gale, W F ^b   North, T H ^c  

^a CANADIAN NUCLEAR LABORATORIES   (Canada)

^b AUBURN UNIVERSITY   (United States)

^c UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; BONDING; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; MATHEMATICAL MODELS; SOLIDIFICATION;

TRANSIENT LIQUID PHASE (TLP) BONDING;

PHASE TRANSITIONS;

EID: 0029544715     PISSN: 09506608     EISSN: 17432804     Source Type: Journal    
DOI: 10.1179/imr.1995.40.5.181     Document Type: Review

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