Void formation in flip-chip solder bumps - Part I

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1995, Pages 14-19

  Goenka, Lakhi ^a   Achari, Achyuta ^a  

^a FORD MOTOR COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUBBLE FORMATION; BUBBLES (IN FLUIDS); COMPUTER SIMULATION; CRACK PROPAGATION; FLIP CHIP DEVICES; FLUID DYNAMICS; HEAT TRANSFER; MATHEMATICAL MODELS; THERMAL EFFECTS; THERMOANALYSIS;

BUBBLE COALESCENCE; HEAT-TRANSFER ANALYSIS; RECIRCULATIVE FLOW; SOLDER BUMPS; SOLDER REFLOW PROCESS; VOID FORMATION;

SOLDERED JOINTS;

EID: 0029541141     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)