Analysis of a Thermally Enhanced Ball Grid Array Package

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 18, Issue 4, 1995, Pages 749-757

  Guenin, Bruce M ^a   Marrs, Robert C ^a   Molnar, Ronald J ^a  

^a Amkor Electronics Inc   (United States)

Author keywords

ance; ball grid array package; calculation; computer simulation; convective heat transfer; Microelectronic packaging; nonlinear; thermal perform

Indexed keywords

ARRAYS; COMPUTER SIMULATION; HEAT CONVECTION; HEAT TRANSFER COEFFICIENTS; MICROELECTRONICS; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

BALL GRID ARRAY PACKAGE; SUPERBGA PACKAGE;

ELECTRONICS PACKAGING;

EID: 0029536623     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.477460     Document Type: Article

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