Merged MEMS-CMOS process using silicon wafer bonding

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 1995, Pages 613-616

  Parameswaran, Lalitha ^a   Hsu, Charles ^a   Schmidt, Martin A ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MOSFET DEVICES; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SUBSTRATES;

MICROELECTROMECHANICAL STRUCTURES; PIEZORESISTIVE PRESSURE SENSORS; SILICON WAFER BONDING;

SILICON SENSORS;

EID: 0029536341     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)