Silicon pressure sensors using a wafer-bonded sealed cavity process

International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, Proceedings

Volumn 2, Issue , 1995, Pages 582-585

  Parameswaran, Lalitha ^a   Mirza, Andrew ^a   Chan, Wendy K ^a   Schmidt, Martin A ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPOSITE MICROMECHANICS; EPITAXIAL GROWTH; INTEGRATED CIRCUITS; MICROMACHINING; PARTIAL PRESSURE SENSORS; PLASMA ETCHING; POLISHING; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE TESTING; SILICON WAFERS; SUBSTRATES;

CAPACITIVE PRESSURE SENSORS; ELECTROCHEMICAL ETCHING; PIEZORESISTIVE PRESSURE SENSORS; SILICON PRESSURE SENSORS; WAFER BONDING;

SILICON SENSORS;

EID: 0029535592     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)