A novel technique for fabrication of metallic structures on polyimide by selective electroless copper plating using ion implantation

Thin Solid Films

Volumn 270, Issue 1-2, 1995, Pages 489-492

  Bhansali, S ^a   Sood, D K ^a  

^a RMIT UNIVERSITY   (Australia)

Author keywords

Copper; Ion implantation; Metallization; Polymers

Indexed keywords

METALLIC STRUCTURE; PALLADIUM ION IMPLANTATION; PROFILOMETRY; SCOTCH TAPE TEST; SELECTIVE ELECTROLESS COPPER PLATING;

ADHESION; COPPER; COPPER PLATING; ELECTROLESS PLATING; ION IMPLANTATION; METALLIZING; NUCLEATION; OPTICAL MICROSCOPY; PALLADIUM; POLYIMIDES; RUTHERFORD BACKSCATTERING SPECTROSCOPY; THIN FILMS;

METALLIC FILMS;

EID: 0029518842     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(95)06881-3     Document Type: Article

References (7)

1. Proc. 7th International Conference on Sensors and Actuators