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Volumn , Issue , 1995, Pages 89-92
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3D modeling of sputter and reflow processes for interconnect metals
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
BINDING ENERGY;
CALCULATIONS;
DIFFUSION IN SOLIDS;
HIGH TEMPERATURE OPERATIONS;
MOLECULAR DYNAMICS;
MONTE CARLO METHODS;
SPUTTER DEPOSITION;
SUBSTRATES;
SURFACES;
THERMAL EFFECTS;
THREE DIMENSIONAL;
ALUMINUM REFLOW;
ALUMINUM SPUTTERING;
INTERCONNECT METALS;
MOLECULAR DYNAMICS SIMULATIONS;
SCALING LAWS;
SURFACE DIFFUSION;
TOPOGRAPHY;
COMPUTER SIMULATION;
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EID: 0029516203
PISSN: 01631918
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (18)
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References (10)
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