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Volumn 391, Issue , 1995, Pages 403-408
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Grain structure and electromigration testing of deep submicrometer Cu interconnects
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Author keywords
[No Author keywords available]
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Indexed keywords
ANNEALING;
BONDING;
CRYSTAL MICROSTRUCTURE;
ELECTROMIGRATION;
ELECTRON BEAM LITHOGRAPHY;
EVAPORATION;
GRAIN GROWTH;
GRAIN SIZE AND SHAPE;
METALLIC FILMS;
METALLIZING;
PHOTORESISTS;
SCANNING ELECTRON MICROSCOPY;
INTEGRATED CIRCUIT INTERCONNECTS;
MICROELECTRONICS;
COPPER INTERCONNECTS;
ELECTROMIGRATION LIFETIME TESTING;
GRAIN STRUCTURE;
LIFT OFF TO LINEWIDTHS;
AS-DEPOSITED FILMS;
CROSS SECTIONAL AREA;
CU-INTERCONNECTS;
DEEP-SUB MICROMETERS;
ELECTROMIGRATION TESTING;
ORDERS OF MAGNITUDE;
STANDARD DEVIATION;
COPPER;
GRAIN GROWTH;
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EID: 0029510518
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-391-403 Document Type: Conference Paper |
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Times cited : (5)
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References (22)
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