Influence of thermal-mechanical effects on resistance changes during and after electromigration experiments

Materials Research Society Symposium - Proceedings

Volumn 391, Issue , 1995, Pages 513-519

  Scorzoni, A ^a   De Munari, I ^a   Stulens, H ^a   D'Haeger, V ^a  

^a CNR   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; ALUMINUM; ELECTRIC RESISTANCE MEASUREMENT; ELECTROMIGRATION; INTEGRATED CIRCUITS; STRESSES; THERMAL EFFECTS; MICROELECTRONICS; STRESS RELAXATION;

HIGH RESOLUTION RESISTOMETRIC METHODS; HYDROSTATIC STRESS RELAXATION; NONLINEAR RESISTANCE BEHAVIOR; PRECIPTATION DISSOLUTION; RESISTANCE CHANGE;

ELECTRIC RESISTANCE; ELECTROMIGRATION;

COMBINED EFFECT; COMPLEMENTARY TECHNIQUES; HIGH RESOLUTION; HYDROSTATIC STRESS; PHYSICAL PHENOMENA; RESISTANCE CHANGE; SIMULTANEOUS EFFECTS; VOID VOLUME;

EID: 0029505080     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (22)