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Volumn , Issue , 1995, Pages 91-92
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Metal etch with HI-addition to conventional chemistry
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ADDITION REACTIONS;
ALUMINUM;
ALUMINUM ALLOYS;
CHLORINE;
CORROSION RESISTANCE;
HYDROGEN INORGANIC COMPOUNDS;
METALLIZING;
MIXTURES;
PHOTORESISTS;
SEMICONDUCTOR DEVICE MANUFACTURE;
TITANIUM NITRIDE;
BARRIER LAYER;
ETCHANT HYDROGEN IODIDE;
METAL ETCH;
PHOTORESIST SELECTIVITY;
PROFILE CONTROL;
RESIDUE FREE ETCHING;
PLASMA ETCHING;
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EID: 0029483745
PISSN: 07431562
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (3)
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