Infrared solder joint inspection on surface mount printed circuit boards

Midwest Symposium on Circuits and Systems

Volumn 1, Issue , 1995, Pages 145-148

  Liu, Roger Z ^a   Shi, Y Q ^a   Kosonocky, W F ^a   Higgins, F P ^a  

^a AT&T Comm Vault Systems ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; CAMERAS; CHARGE COUPLED DEVICES; COMPUTER VISION; IMAGE PROCESSING; INFRARED INSTRUMENTS; INSPECTION; INSPECTION EQUIPMENT; PATTERN RECOGNITION; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

IMAGE PROCESSING SYSTEMS; INFRARED CAMERA; INFRARED INSPECTION SYSTEM; STATISTICAL PATTERN RECOGNITION ALGORITHM;

INFRARED IMAGING;

EID: 0029462973     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)