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Volumn 5, Issue 4, 1995, Pages 277-287
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Conduction and microstructure development in Ag-filled epoxies
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CURING;
DIFFERENTIAL SCANNING CALORIMETRY;
ELECTRIC CONDUCTIVITY;
ELECTRIC PROPERTIES;
ELECTRIC RESISTANCE;
HEATING;
KINETIC THEORY;
MECHANICAL PROPERTIES;
MICROSTRUCTURE;
RELIABILITY;
SCANNING ELECTRON MICROSCOPY;
THERMOGRAVIMETRIC ANALYSIS;
CURE KINETICS;
DEGREE OF CURE;
DYNAMIC MECHANICAL ANALYSIS;
SILVER FILLED EPOXIES;
ADHESIVES;
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EID: 0029461374
PISSN: 09603131
EISSN: None
Source Type: Journal
DOI: 10.1142/S0960313195000293 Document Type: Article |
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Times cited : (7)
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References (9)
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