Aluminum/silicon carbide (AlSiC) metal matrix composites for advanced packaging applications

Proceedings of the International Electronics Packaging Conference

Volumn , Issue , 1995, Pages 220-227

  Novich, Bruce E ^a   Adams, Richard W ^a  

^a Ceramics Process Systems Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COST EFFECTIVENESS; ELECTRIC CONDUCTIVITY; INTEGRATED CIRCUITS; METALLIC MATRIX COMPOSITES; MICROELECTRONICS; MICROSTRUCTURE; SILICON CARBIDE; STIFFNESS; STRENGTH OF MATERIALS; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION; QUICKCAST LIQUID METAL INFILTRATION PROCESS;

ELECTRONICS PACKAGING;

EID: 0029457356     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)