Enhanced heat transfer in the entrance region of microchannels

Proceedings of the Intersociety Energy Conversion Engineering Conference

Volumn 2, Issue , 1995, Pages 289-294

  Gui, Fulin ^a   Scaringe, Robert P ^a  

^a MAINSTREAM ENGINEERING CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY LAYERS; CHANNEL FLOW; COOLING; HEAT CONVECTION; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; NUSSELT NUMBER; SILICON WAFERS; SURFACE ROUGHNESS; TURBULENCE; ULSI CIRCUITS;

ELECTRONIC CHIPS; FLUID FLOW MODE; FLUID PROPERTY VARIATION; MICROCHANNEL COOLING; MICROCHANNEL PASSAGE GEOMETRY; SINGLE PHASE FLOW; THERMAL BOUNDARIES;

HEAT TRANSFER;

EID: 0029457345     PISSN: 0146955X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)