Modelling of the initial stages of the anisotropic adhesive joint assembly process

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1995, Pages 142-145

  Mannan, Samjid H ^a   Whalley, David C ^a   Ogunjimi, Yinka O ^a   Williams, David J ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ASSEMBLY; COMPUTATIONAL FLUID DYNAMICS; FLIP CHIP DEVICES; FLOW OF FLUIDS; MATHEMATICAL MODELS; PARTICLES (PARTICULATE MATTER); PERFORMANCE; PRESSURE EFFECTS; PROCESS CONTROL; THERMAL EFFECTS; VISCOSITY;

ADHESIVE JOINT ASSEMBLY; ADHESIVE RESIN FLOW; APPLIED PRESSURE; BUMP GEOMETRY; CONDUCTING PARTICLES; PARTICLE DISTRIBUTION; TEMPERATURE RAMP RATE;

ADHESIVE JOINTS;

EID: 0029453664     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)