Market for ball grid array packages

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1995, Pages 205-207

  Vardaman, E Jan ^a   Crowley, Robert ^a   Goodman, Thomas ^a  

^a TECHSEARCH INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; FLIP CHIP DEVICES; INTEGRATED CIRCUITS; MARKETING; RELIABILITY; SEMICONDUCTOR MATERIALS; SURFACE MOUNT TECHNOLOGY;

BALL GRID ARRAY; GLASS EPOXY SUBSTRATE; OVERMOLDED PAD ARRAY CARRIER;

ELECTRONICS PACKAGING;

EID: 0029452948     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)