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Volumn 2636, Issue , 1995, Pages 277-288
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A comparative study of sub-micron gap filling and planarization techniques
a
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Author keywords
APL; Dep etch dep; Gap filling; Global planarization; IMD; Local planarization; Ozone TEOS
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Indexed keywords
ADHESION;
ANNEALING;
ASPECT RATIO;
ATMOSPHERIC PRESSURE;
ETCHING;
MASKS;
OZONE;
PHOTOLITHOGRAPHY;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SCANNING ELECTRON MICROSCOPY;
SURFACE TOPOGRAPHY;
PLANARIZATION TECHNIQUES;
SUB-MICRON GAP FILLING;
DIELECTRIC MATERIALS;
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EID: 0029419262
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.221142 Document Type: Conference Paper |
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Times cited : (1)
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References (17)
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