Etching technology and applications for "through-the-wafer" Silicon etching

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2639, Issue , 1995, Pages 259-263

  Craven, David ^a   Yu, Keven ^a   Pandhumsoporn, Tam ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

Anisotropic Silicon etching; Deep Silicon etching; High aspect ratio Silicon etching; High density plasma etching

Indexed keywords

ANISOTROPY; ASPECT RATIO; CRYSTALLOGRAPHY; PLASMA ETCHING;

HIGH DENSITY PLASMA ETCHING;

MICROELECTROMECHANICAL DEVICES;

EID: 0029419214     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.221296     Document Type: Conference Paper

References (7)

1. Can micromachining deliver?
2. Silicon fusion bonding and deep reactive ion etching; A new technology for microstructures
3. The black silicon method V: A study of the fabricating of movable structures for microelectromechanical systems
4. 2
5. Development of micromachined devices using polyimide-based processes
6. Low temperature etching of Si and P.R. in high density plasmas