A batch dissolved wafer process for low cost sensor applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2639, Issue , 1995, Pages 10-17

  Cho, Steve T ^a  

^a Silicon Video Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; GYROSCOPES; MICROMACHINING; SILICON WAFERS; TRANSDUCERS;

DISSOLVED WAFER PROCESS;

MICROSENSORS;

EID: 0029419213     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.221265     Document Type: Conference Paper

References (9)

1. An ultrasensitive silicon pressure-based microflow sensor
2. Silicon diaphragm capacitive sensor for pressure, flow, acceleration, and attitude measurement
3. A tuning fork rate gyroscope
4. A bulk silicon capacitive microaccelerometer with built-in overrange and force feedback electrodes
5. Anistropic etching of silicon with KOH-water isopropyl alcohol
6. A new silicon-on-glass process for integrated sensors
7. Ethylene diamine-pyrocatechol water shows etching anomaly in boron-doped silicon
8. A bulk silicon dissolved wafer process for microelectromechanical devices