A combined TMAH and HF sacrificial layer etching technique for surface micromachined devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2639, Issue , 1995, Pages 286-293

  Lisec, Thomas ^a   Kreutzer, Martin ^a   Wenk, Beatrice ^a   Wagner, Bernd ^a  

^a Fraunhofer Inst F S   (Germany)

Author keywords

Noise in piezoresistor arrangements; Piezoresistive pressure sensor; Surface micromachining; TMAH sacrificial layer etching

Indexed keywords

ETCHING; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POLYSILICON; SENSORS; SOLUTIONS; SPURIOUS SIGNAL NOISE;

PIEZORESISTIVE PRESSURE SENSORS; SURFACE MICROMACHINING;

MICROMACHINING;

EID: 0029419198     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.221285     Document Type: Conference Paper

References (10)

1. Process technology for the modular integration of CMOS and polysilicon microstructures
2. Electrostatically driven vacuum-encapsulated polysilicon resonators: Part I. Design and fabrication
3. Hydrofluoric acid etching of silicon dioxide sacrificial layers
4. Surface-micromachined microdiaphragm pressure sensors
5. Micro-diaphragm pressure sensor using polysilicon sacrificial layer etch-stop technique
6. A small-size silicon microphone for measurements in turbulent gas flows
7. Deposition of thick doped polysilicon films with low stress in an epitaxial reactor for surface micromachining applications
8. Surface-micromachined piezoresistive pressure sensor