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Volumn 2639, Issue , 1995, Pages 224-233

Advanced silicon etching using high density plasmas

Author keywords

Dry etching; Etch mechanisms; High density plasmas; Micro machining; Silicon

Indexed keywords

ANISOTROPY; ETCHING; MICROMACHINING; PASSIVATION; PLASMAS; SEMICONDUCTING SILICON;

EID: 0029419192     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.221279     Document Type: Conference Paper
Times cited : (232)

References (17)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.