|
Volumn 2639, Issue , 1995, Pages 224-233
|
Advanced silicon etching using high density plasmas
a a |
Author keywords
Dry etching; Etch mechanisms; High density plasmas; Micro machining; Silicon
|
Indexed keywords
ANISOTROPY;
ETCHING;
MICROMACHINING;
PASSIVATION;
PLASMAS;
SEMICONDUCTING SILICON;
HIGH DENSITY PLASMAS;
MICROELECTROMECHANICAL DEVICES;
|
EID: 0029419192
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.221279 Document Type: Conference Paper |
Times cited : (232)
|
References (17)
|