Material and processing issues for the monolithic integration of microelectronics with surface-micromachined polysilicon sensors and actuators

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2639, Issue , 1995, Pages 64-73

  Smith, J H ^a   Montague, S ^a   Sniegowski, J J ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

CMOS; Integration; Micromechanics; Smart sensors; Tungsten

Indexed keywords

ACTUATORS; ALUMINUM; CMOS INTEGRATED CIRCUITS; METALLIZING; MICROELECTRONICS; MICROMACHINING; POLYSILICON; SENSORS;

SMART SENSORS;

MICROELECTROMECHANICAL DEVICES;

EID: 0029419012     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.221301     Document Type: Conference Paper

References (4)

1. A surface micromachined silicon accelerometer with on-chip detection circuitry
2. Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry
3. Polysilicon integrated microsystems: Technologies and applications
4. Embedded micromechanical devices for the monolithic integration of MEMS with CMOS