Three-Dimensional MMIC Technology: A Possible Solution to Masterslice MMIC’s on GaAs and Si

IEEE Microwave and Guided Wave Letters

Volumn 5, Issue 11, 1995, Pages 411-413

  Tokumitsu, Tsuneo ^a   Aikawa, Masayoshi ^a   Kohiyama, Kenji ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); ELECTRODES; INTEGRATED CIRCUIT LAYOUT; METALS; MICROWAVE CIRCUITS; RESISTORS; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE STRUCTURES; SILICON WAFERS; SUBSTRATES; THREE DIMENSIONAL; TRANSISTORS;

CIRCUIT STACKING EFFECT; MASTER ARRAY ELEMENTS; MICROWAVE CIRCUIT DESIGN; X BAND AMPLIFIER;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0029409137     PISSN: 10518207     EISSN: None     Source Type: Journal    
DOI: 10.1109/75.473525     Document Type: Article

References (7)

1. Procs. IEEE Microwave and Millimeter-Wave Monolithic Circuits Symp. 1988-1994.
2. T. Hiraoka, T. Tokumitsu, and M. Aikawa, “Very small wide-banc MMIC magic T’s using microstrip lines on a thin dielectric film,” IEEE Trans. Microwave Theory Tech., vol. 37, no. 10, pp. 1569-1575, Oct 1989.
3. T. Tokumitsu, T. Hiraoka, H. Nakamoto, and T. Takenaka, “Multilayer MMIC using a 3 pm x 3-layer dielectric film structure,” in Proc. IEEE MTT-S Int. Microwave Symp., May 1990, pp. 831-834.
4. S. Banba and H. Ogawa, “Small-sized MMIC amplifiers using thin dielectric layers,” IEEE Trans. Microwave Theory Tech., vol. 43, no. 3, pp. 485-492, Mar. 1995.
5. T. Tokumitsu, I. Toyoda, K. Nishikawa, and K. Kamogawa, “Three-dimensional MMIC amplifier design and performance (in Japanese),” in IEICE Spring National Convention Record, Mar. 1995, C-96.
6. I. Toyoda, K. Nishikawa, K, Kamogawa, and T. Tokumitsu, “Three-dimensional MMIC X-band single-chip receiver (in Japanese),” in IEICE Spring National Convention Record, Mar. 1995, C-163.
7. I. Toyoda, T. Hirota, and T. Tokumitsu, “Multilayer MMIC branch-line coupler and broad-side coupler,” in Proc. IEEE Microwave and Millimeter-Wave Monolithic Circuits Symp., June 1992, pp. 79-82.