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Journal of the American Ceramic Society

Volumn 78, Issue 9, 1995, Pages 2345-2352

Effect of the Grain Boundary Thermal Expansion Coefficient on the Fracture Toughness in Silicon Nitride

(2) Peterson, Irene M a Tien, Tseng‐Ying a

a UNIVERSITY OF MICHIGAN (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; FRACTURE TOUGHNESS; GRAIN BOUNDARIES; MICROSTRUCTURE; PHASE COMPOSITION; RESIDUAL STRESSES; SINTERING; SYSTEMS (METALLURGICAL); TENSILE PROPERTIES; THERMAL EXPANSION;

GRAIN BOUNDARY PHASES; GRAIN BOUNDARY THERMAL EXPANSION COEFFICIENT; GRAIN BRIDGING; THERMAL EXPANSION MISMATCH STRESS;

SILICON NITRIDE;

EID: 0029378769 PISSN: 00027820 EISSN: 15512916 Source Type: Journal
DOI: 10.1111/j.1151-2916.1995.tb08667.x Document Type: Article

Times cited : (116)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.