Laser via ablation technology for MCM-D fabrication at IBM microelectronics

International Journal of Microcircuits and Electronic Packaging

Volumn 18, Issue 3, 1995, Pages 266-274

  Patel, R S ^a   Redmond, T F ^a   Tessler, C ^a   Tudryn, D ^a   Pulaski, D ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; LASER ABLATION; MICROELECTRONICS; PHOTOSENSITIVITY; POLYMERS; REACTIVE ION ETCHING; THIN FILM DEVICES;

LASER VIA ABLATION TECHNOLOGY; MULTILEVEL THIN FILM PACKAGING; VIA FORMATION;

MULTICHIP MODULES;

EID: 0029368149     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (19)