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Volumn 24, Issue 8, 1995, Pages 969-974
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Enhanced stress-migration reliability for ULSI interconnect: An insight into the perils of screening Al depositions based on grain size
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Author keywords
Aluminum; grain size; reliability; stress migration (SM); void
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Indexed keywords
ALUMINUM;
DIFFUSION;
FABRICATION;
FAILURE ANALYSIS;
FINITE ELEMENT METHOD;
GRAIN SIZE AND SHAPE;
RELIABILITY;
STRESSES;
INTERCONNECTS;
PACKING DENSITY;
STRESS MIGRATION;
ULSI CIRCUITS;
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EID: 0029352836
PISSN: 03615235
EISSN: 1543186X
Source Type: Journal
DOI: 10.1007/BF02652969 Document Type: Article |
Times cited : (3)
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References (6)
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