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Volumn 24, Issue 8, 1995, Pages 969-974

Enhanced stress-migration reliability for ULSI interconnect: An insight into the perils of screening Al depositions based on grain size

Author keywords

Aluminum; grain size; reliability; stress migration (SM); void

Indexed keywords

ALUMINUM; DIFFUSION; FABRICATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; GRAIN SIZE AND SHAPE; RELIABILITY; STRESSES;

EID: 0029352836     PISSN: 03615235     EISSN: 1543186X     Source Type: Journal    
DOI: 10.1007/BF02652969     Document Type: Article
Times cited : (3)

References (6)
  • 3
    • 84936496727 scopus 로고    scopus 로고
    • V. Ryan and S. Chittipeddi, Advanced Metallization for ULSI Applications Conference, San Diego, CA, 1993.
  • 6
    • 84936496724 scopus 로고    scopus 로고
    • V. Ryan, S.A. Lytle, N.M. McCurry, D.P. Favreau and S. Chittipeddi, The Electrochemical Society 182nd Mtg., Toronto (Canada), 1992.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.