Flip-chip bonding using superconducting solder bump

Japanese Journal of Applied Physics

Volumn 34, Issue 8 R, 1995, Pages 4043-4046

  Ogashiwa, Toshinori ^a,b   Nakagawa, Hiroshi ^a,b   Akimoto, Hideyuki ^a   Shigyo, Hiroyuki ^a   Takada, Susumu ^a,b  

^a Tanaka Denshi Kogyo Ltd ^*  (Japan)

^b ELECTROTECHNICAL LABORATORY   (Japan)

Author keywords

Chemical acid free; Face down bonding; Nb Pd film pad; Pb 2Sn 0.1Cu 0.5Sb 1 Au alloy wire; Superconducting flip chip bonding; Thermosonic compression bonding; Wire bonding machine

Indexed keywords

CERAMIC MATERIALS; ELECTRIC WIRE; METALLIC FILMS; SEMICONDUCTOR DEVICE MANUFACTURE; SHEAR STRENGTH; SOLDERING; SUBSTRATES; SUPERCONDUCTING MATERIALS; THERMAL CYCLING;

FACE DOWN BONDING; LEAD TIN COPPER GOLD ALLOY WIRE; NIOBIUM/PALLADIUM FILM PAD; SUPERCONDUCTING SOLDER BUMPS; THERMOSONIC COMPRESSION BONDING; WIRE BONDING MACHINE;

FLIP CHIP DEVICES;

EID: 0029352466     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.34.4043     Document Type: Article

References (3)

1. H. Nakagawa, I. Kurosawa, M. Aoyagi, S. Kosaka, Y. Hamazaki, Y. Okada and S. Takada: IEEE Trans. Appl. Super-cond. 1 (1991) 37.
2. T. Ogashiwa, C. Kamada, A. Inoue and T. Masumoto: Proc. 6th Int. Microelectronics Conf., Tokyo, 1990 (Society of Hybrid Microelectronics, Tokyo, 1990) p. 228.
3. T. Ogashiwa, H. Nakagawa, H. Akimoto, H. Shigyo and S. Takada: Jpn. J. Appl. Phys. 31 (1992) L36.