The effects of finite dielectric layers in multilevel microstrip interconnects

International Journal of Microwave and Millimeter‐Wave Computer‐Aided Engineering

Volumn 5, Issue 4, 1995, Pages 256-263

  Engel, Andrew G ^a   Katehi, Linda P B ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTRIC CONDUCTORS; ESTIMATION; FREQUENCY DOMAIN ANALYSIS; INTEGRAL EQUATIONS; PROBLEM SOLVING; SUBSTRATES; TIME DOMAIN ANALYSIS; VLSI CIRCUITS;

COPLANAR CONDUCTORS; FINITE DIELECTRIC LAYERS; FINITE WIDTH SUBSTRATES; INTEGRAL EQUATION MODE MATCHING; MULTILEVEL MICROSTRIP INTERCONNECTS;

MICROSTRIP LINES;

EID: 0029345930     PISSN: 10501827     EISSN: 15226301     Source Type: Journal    
DOI: 10.1002/mmce.4570050404     Document Type: Article

References (9)

1. Frequency and Time Domain Characterization of Microstrip‐Ridge Structures
2. Microstrip Transmission Line with Finite‐Width Dielectric and Ground Plane
3. Analysis of Microstrip Structures on and Near Dielectric Ridges Using an Integral Equation‐Mode Matching Technique
4. The Behaviour of Electromagnetic Fields at Edges
5. Reciprocity Related Definition of Strip Characteristic Impedance for Multiconductor Hybrid‐Mode Transmission Lines
6. Characteristic Impedance of Multilevel, Multiconductor Hybrid Mode Microstrip
7. An Equivalent Circuit Model for Terminated Hybrid‐Mode Multiconductor Transmission Lines
8. Transmission Line Properties of Parallel Strips Separated by a Dielectric Sheet
9. Pulse Distortion on Multilayer Coupled Microstrip Lines