Long-throw low-pressure sputtering technology for very large-scale integrated devices

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 13, Issue 4, 1995, Pages 1906-1909

  Motegi, Nobuhiro ^a   Kashimoto, Yuzou ^a   Nagatani, Koji ^a   Takahashi, Seiichi ^a   Kondo, Tomoyasu ^a   Mizusawa, Yasushi ^a   Nakayama, Izumi ^a  

^a UVLAC Japan Ltd ^*  (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; FILMS; GEOMETRY; PLASMAS; PRESSURE EFFECTS; SPUTTER DEPOSITION; TITANIUM; TITANIUM COMPOUNDS; TITANIUM NITRIDE; VLSI CIRCUITS;

BARRIER METAL DEPOSITION; COLLIMATION DEPOSITION; GLUE LAYER FORMATION; LONG THROW SPUTTER;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0029342655     PISSN: 0734211X     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.587833     Document Type: Article

References (5)