Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines

IBM Journal of Research and Development

Volumn 39, Issue 4, 1995, Pages 465-497

  Hu, C K ^a   Rodbell, K P ^a   Sullivan, T D ^a   Lee, K Y ^a   Bouldin, D P ^a  

^a IBM RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ALUMINUM ALLOYS; CONDUCTIVE FILMS; DEPOSITION; ELECTRIC CONDUCTORS; ELECTROMIGRATION; HEAT TREATMENT; LOGIC CIRCUITS; MICROPROCESSOR CHIPS; MICROSTRUCTURE; THIN FILMS; VLSI CIRCUITS;

MEMORY CHIPS; ON-CHIP INTERCONNECTIONS; PRECIPITATE; SOLUTE; STRESS-INDUCED VOIDING; THERMAL PROCESSING; THIN-FILM LINES;

ELECTRIC LINES;

EID: 0029333576     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.394.0465     Document Type: Article

References (91)