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Thin Solid Films

Volumn 262, Issue 1-2, 1995, Pages 135-141

Electromigration in copper conductors

(2) Lloyd, J R a Clement, J J a

a HEWLETT PACKARD COMPANY (United States)

Author keywords

Copper; Electromigration

Indexed keywords

ACTIVATION ENERGY; CRYSTAL LATTICES; CURRENT DENSITY; DIFFUSION IN SOLIDS; ELECTRIC CONDUCTORS; ELECTROMIGRATION; GRAIN BOUNDARIES;

CROSS OVER TEMPERATURE; INTERFACIAL DIFFUSION PATH; LATTICE DIFFUSION;

COPPER;

EID: 0029327239 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/0040-6090(94)05806-7 Document Type: Article

Times cited : (210)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.