Quantitative characterization of a flip-chip solder joint

Journal of Applied Mechanics, Transactions ASME

Volumn 62, Issue 2, 1995, Pages 390-397

  Patra, S K ^a,c   Sritharan, S S ^b   Lee, Y C ^a  

^a UNIVERSITY OF COLORADO   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNMENT; COST EFFECTIVENESS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MATHEMATICAL MODELS; NUMERICAL METHODS; OPTOELECTRONIC DEVICES; SOLDERING; SUBSTRATES;

ENERGY MINIMIZATION PRINCIPLE; QUANTITATIVE CHARACTERIZATION; SOLDER METALLIZATION;

SOLDERED JOINTS;

EID: 0029322163     PISSN: 00218936     EISSN: 15289036     Source Type: Journal    
DOI: 10.1115/1.2895943     Document Type: Article

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