A Fully Automated Pulsed Laser Deposition System for HTS Multilayer Devices

IEEE Transactions on Applied Superconductivity

Volumn 5, Issue 2, 1995, Pages 1661-1664

  Clark, J H ^a   Donaldson, G B ^a   Bowman, R M ^b  

^a UNIVERSITY OF STRATHCLYDE   (United Kingdom)

^b QUEEN'S UNIVERSITY BELFAST   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATION; CONTROL SYSTEMS; DEPOSITION; FILM GROWTH; HIGH TEMPERATURE SUPERCONDUCTORS; MULTILAYERS; OPTIMIZATION; PULSED LASER APPLICATIONS; ROBUSTNESS (CONTROL SYSTEMS); SUPERCONDUCTING FILMS; VACUUM APPLICATIONS;

CONFLAT FLANGES; PULSED LASER DEPOSITION; STAINLESS STEEL VACUUM CHAMBER;

SUPERCONDUCTING DEVICES;

EID: 0029321902     PISSN: 10518223     EISSN: 15582515     Source Type: Journal    
DOI: 10.1109/77.402895     Document Type: Article

References (8)

1. G. Taguchi, “Introduction to Quality Engineering—designing quality into products and processes, “Asian Productivity Organization, Minato-Ku, Japan, 1986.
2. P. C. Chou et al., “Optimization of Jc for photo-assisted MOCVD prepared YBCO thin films by Robust Design,'’ Texas Centre for Superconductivity, unpublished.
3. M. S. Phadke, “Quality engineering using Robust Design”, Prentice Hall 1989, ISBN 0-13-745167-9.
4. R. M. Bowman, Pulsed laser deposition of high temperature superconducting thin films for SQUID applications”, University of Strathclyde Ph.D. Thesis 1992.
5. M. C. Foote et al., “Composition variations in pulsed-laser-deposited Y-Ba-Cu-O thin films as a function of deposition parameters, “Physica C Vol. 201, pp. 176-182, 1992.
6. H. S. Kim and H. S. Kwok, “Correlation between target-substrate distance and oxygen pressure in pulsed laser deposition of YBa2Cu3O2” Appl. Phys. Lett. Vol. 61 pp. 2234-2236, 1992.
7. R. E. Muenchausen, K. M. Hubbard, S. Foltyn, R. C. Estler, C. Jenkins, “Effects of beam parameters on excimer laser deposition of YBa2Cu3O7-δAppl. Phys. Lett. Vol. 56 pp. 578-580, 1990.
8. K. Zach et al., “Laser ablated YBCO thin films—relations between structural and electrical properties,” Journal of Alloys and Compounds, Vol. 195, pp. 199-202, 1993.