Electrically Conductive Adhesives: A Prospective Alternative for SMD Soldering?

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 18, Issue 2, 1995, Pages 292-298

  Jagt, J C ^a   Beris, P J M ^a   Lijten, G F C M ^a  

^a Philips Center for Manufacturing Technology ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVES; CONTACT RESISTANCE; ELECTRIC CONNECTION; FINE PITCH CAPABILITY; METALLIZATION;

BONDING; CONDUCTIVE MATERIALS; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; MECHANICAL PROPERTIES; MOISTURE; PRINTED CIRCUIT BOARDS; SHRINKAGE; SILVER COMPOUNDS; SOLDERING; SURFACE MOUNT TECHNOLOGY; TIN COMPOUNDS;

ADHESIVES;

EID: 0029307213     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.386264     Document Type: Article

References (9)

1. R. A. Bourdelaise, “Solderless alternatives to surface mount component attachment,” Soldering Surf. Mount Technol., vol. 8, pp. 13-15, 23, 1991.
2. H. Yoshigahara, Y. Sagami, S. Nose, and A. Burkhart, “Conductive epoxies for attachment of surface mount devices,” in Proc. 4th SAMPE Electron. Conf., 1990, pp. 255-266.
3. H. L. Hvims, Electrically Conductive Adhesives for SMT: Reliability, Design Guidelines and Applications for Solder Replacement. Hoersholm, Denmark: Elektronik Centrale, 1993
4. D. L. Kopp and M. G. Bevan, “Conductive adhesive substitutes for tin—lead solder,” in NEPCON West, 1993, pp. 1501-1509.
5. Solder replacement: A critical analysis,” Technology & Management, BPA, Dorking, UK, Rep. 535, 1994.
6. P. C. P. Bouten, “On the stability of the adhesive layer thickness,” presented at the 4th Int. Adhesion Conf., Cambridge, England, 1990.
7. J. L. va n Kooyk, “UV-curable adhesives, rate of cure, shrinkage and stability,” in Proc. 8th Int. Swiss Bonding Symp., 1994, pp. 283-298.
8. H. Schäfer et al., “AEM-Untersuchungen an Grenzschichten in elektrisch leitfähigen Klebverbindungen,” in DVS Berichte, Band 141, Verbindungstechnik in der Elektronik Vorträge und Posterbeiträge des 6. Internationalen Kolloquiums in Fellbach, 1992.
9. P. J. Kay and C. A. Mackay, “The growth of intermetallic compounds on common basis materials coated with tin and tin-lead alloys,” Trans. Inst. Metal Finishing, vol. 54, pp. 68-74, 1976.