High-Performance Semiconductor Optical Amplifier Array for Self-Aligned Packaging Using Si V-Groove Flip-Chip Technique

IEEE Photonics Technology Letters

Volumn 7, Issue 5, 1995, Pages 476-478

  Leclerc, D ^a   Brosson, P ^a   Pommereau, F ^a   Ngo, R ^a   Doussiare P ^a   Mallcot, F ^a   Gavignet, P ^a   Warmsler, I ^b   Laube, G ^b   Hunziker, W ^c   Vogt, W ^c   Melchior, H ^c  

^a NOKIA RESEARCH CENTER   (United States)

^b Alcatel CIT Centre de Villarceaux ^*  (Germany)

^c ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

FIBER TO FIBER GAIN; MULTIFIBER MODULE; SELF ALIGNED PACKAGING; SILICON MOTHER BOARD;

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; OPTICAL COMMUNICATION; OPTICAL SWITCHES; POLARIZATION; SEMICONDUCTOR DEVICE STRUCTURES; SURFACE MOUNT TECHNOLOGY;

SEMICONDUCTOR LASERS;

EID: 0029305370     PISSN: 10411135     EISSN: 19410174     Source Type: Journal    
DOI: 10.1109/68.384515     Document Type: Article

References (7)

1. D. Chiaroni, P. Gavignet-Morin, P. A. Perrier, S. Ruggeri, S. Gauchard, D. de Bouard, J.-C. Jacquinot, C. Chauzat, J. Jacquet, P. Doussière M. Monnot, E. Grard, D. Leclerc, M. Sotorn, J-M. Gabriagues, and J. Benoit, “Rack-mounted 2.5 Gbit/s ATM photonic switch demonstrator,” in ECOC ‘93, ThP 12.7, 1993, pp. 77–80.
2. Y. Yamada. H. Terui, Y. Ohmori, M. Yamada, A. Himeno, and M. Kobayashi, “Hybrid-integrated 4 × 4 optical gate matrix switch using Silica-based optical waveguides and LD array chips,” J. Ligthwave Technol., vol. 10, pp. 383–390, 1992.
3. S. Kitamura, K. Komatsu, and M. Kitamura, “Polarization-insensitive semiconductor optical amplifier array grown by selective MOVPE,” IEEE Photon. Technol. Lett., vol. 6, pp. 173–175, 1994.
4. W. Hunziker, W. Vogt, H. Melchior, P. Brosson, P. Doussière T. Fillion, G. Gelly, J.-L. Gentner, D. Leclerc, R. Ngo, A. Pinquier, F. Pommereau, J.-G. Provost, and J.-F. Vinchant, “Self-aligned tilted amplifier array packaging using Si V-groove flip-chip technique for gate array applications,” in OAA ‘94 Tech. Dig., PD4, 1994.
5. D. Leclerc, P. Brosson, F. Pommereau, R. Ngo, P. Doussière F. Mallecot, T. Fillion, G. Gelly, C. Artigue, E. Grard, J.-L. Gentner, A. Pinquier, J.-G. Provost, J.-F. Vinchant, I. Wamsler, G. Laube, W. Hunziker, W. Vogt, and H. Melchior, “High performance semiconductor amplifier array for self-aligned packaging using Si V -groove flip-chip technique,” ECOC ‘94 Tech. Dig., Th. B4, 1994, pp. 117–120.
6. W. Hunziker, W. Vogt, and H. Melchior, “Self-aligned optical flip-chip OEIC packaging technologies,” in ECOC ‘93 Tech. Dig., Invited paper, 1993, pp. 84–91.
7. P. Doussière P. Garabédian C. Graver, D. Bonnevie, T. Fillion, E. Derouin, M. Monnot, J.-G. Provost, and D. Leclerc, “1.55 µm polarization independent semiconductor optical amplifier with 25 dB fiber to fiber gain,” IEEE Photon. Technol. Lett., vol. 6, pp. 170--172, 1994.