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Volumn 18, Issue 1, 1995, Pages 39-47
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Analysis of Thermal Transient Data with Synthesized Dynamic Models for Semiconductor Devices
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CALCULATIONS;
ELECTRONICS PACKAGING;
HEAT RESISTANCE;
SEMICONDUCTOR DEVICE MODELS;
TEMPERATURE MEASUREMENT;
THERMOANALYSIS;
CYCLIC DEVICE POWERING CONDITIONS;
JUNCTION TO AMBIENT THERMAL RESISTANCE;
JUNCTION TO CASE THERMAL STEP RESPONSES;
SYNTHESIZED DYNAMIC MODELS;
THERMAL CAPACITANCES;
THERMAL IMPEDANCE;
THERMAL TRANSIENT DATA;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 0029275470
PISSN: 10709886
EISSN: None
Source Type: Journal
DOI: 10.1109/95.370733 Document Type: Article |
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Times cited : (123)
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References (4)
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