Simulations of trench-filling profiles under ionized magnetron sputter metal deposition

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 13, Issue 2, 1995, Pages 183-191

  Hamaguchi, S ^a   Rossnagel, S M ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; EQUATIONS OF MOTION; ETCHING; ION BOMBARDMENT; MAGNETRON SPUTTERING; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION; VELOCITY;

SHOCK TRACKING ALGORITHM; TRENCH FILLING PROFILES;

METALLIC FILMS;

EID: 0029275415     PISSN: 0734211X     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.587995     Document Type: Article

References (13)