A Boundary Element Formulation of the Conjugate Heat Transfer from a Convectively Cooled Discrete Heat Source Mounted on a Conductive Substrate

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 18, Issue 1, 1995, Pages 108-116

  Kabir, Humayun ^a   Ortega, Alfonso ^a   Chan, Cho Lik ^a  

^a UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; BOUNDARY ELEMENT METHOD; COOLING; ESTIMATION; GEOMETRY; HEAT CONVECTION; HEAT TRANSFER; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; PROBLEM SOLVING; SUBSTRATES;

BOARD LEVEL THERMAL MANAGEMENT; CONDUCTIVE SUBSTRATE; CONJUGATE HEAT TRANSFER; CONVECTIVELY COOLED DISCRETE HEAT SOURCE; DIRECT AIR COOLED BOARD; EFFECTS OF BOARD CONDUCTIVITY; INTERFACE TEMPERATURES; THERMAL ALGORITHMS;

ELECTRONICS PACKAGING;

EID: 0029273811     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.370743     Document Type: Article

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