High Reliability Internal Capacitor of LTCC

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 18, Issue 1, 1995, Pages 170-173

  Baba, Yasuyuki ^a   Ochi, Hiroshi ^a   Segawa, Shigetoshi ^a  

^a Matsushita Kotobuki Elect Ind Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTALLIZATION; ELECTRIC CONDUCTORS; ELECTRODES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONIC PROPERTIES; FILMS; POWDERS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TEMPERATURE; X RAY CRYSTALLOGRAPHY;

CO FIRING CONDUCTOR; CONVENTIONAL DOCTOR BLADING PROCESS; CRYSTALLINE PHASE; CURIE TEMPERATURE; INTERNAL CAPACITOR; LAMINATED GREEN SHEETS; LEAD BOROSILICATE GLASS POWDER; SILICONE COATED POLYPHENYLENE SULFIDE FILM;

CAPACITORS;

EID: 0029271385     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.370751     Document Type: Article

References (8)

1. R. R. Tummala, “Multichip packaging in IBM-past, present and future,” in 1993 Proc. Int. Conf. MCM’s, 1993, pp. 366–367.
2. K. Yokouchi, N. Kamehara, and K. Niwa, “Packaging technology for high-speed computers multilayer glass/ceramic circuit board,” in Proc. ISHM '91, pp. 183–186.
3. Y. Shimada, A. Dohya, K. Kata, and J. Inasaka, “High speed computer packaging with multilayer glass-ceramic substrate,” in Proc. ISHM ’91, 176–182.
4. Y. Shimada, K. Utsumi, T. Ikeda, and Sh. Nagasako, “Monolithic multi-components ceramic (mmc) substrate,” Proc. IMC 1984, pp. 227–234.
5. S. Nishigaki, J. Fukuta, S. Yano, H. Kawabe, K. Noda and M. Fukaya, “A new low temperature fireable Ag multilayer ceramic substrate having fired Cu conductor (LFC-2),” Proc. ISHM ’86, pp. 429–449.
6. Y. Baba, Japan Patent, H4-47476.
7. Y. Baba, K. Higashiyama, S. Segawa, T. Ishida, and S. Nakatani, “Co-fireable copper multilayered ceramic substrates,” in 1989 Japan IEMT Symp., pp. 30–33.
8. Y. Baba, K. Higashiyama, S. Segawa, S. Fukunaga, and J. Shigemi, “High density multilayer ceramic substrate,” in Proc. ISHM '91, pp. 498–501.