MCM Substrate with High Capacitance

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 18, Issue 1, 1995, Pages 23-27

  Kambe, Rokuro ^a   Imai, Ryuji ^a   Takada, Toshikatsu ^a   Arakawa, Michiya ^a   Kuroda, Masao ^a  

^a NGK SPARK PLUG CO LTD   (Japan)

Author keywords

chip capacitor; copper polyimide; decoupling capacitor; ing noise; MCM; simultaneous switch ; Thin film capacitor

Indexed keywords

CAPACITANCE; CAPACITORS; CERAMIC MATERIALS; DIELECTRIC MATERIALS; ELECTRODES; ELECTRONICS PACKAGING; FREQUENCIES; PERMITTIVITY; SEMICONDUCTING FILMS; SPURIOUS SIGNAL NOISE; SUBSTRATES; SWITCHING;

CHIP CAPACITOR; CO-FIRED CERAMIC SURFACE; COPPER POLYIMIDE; DECOUPLING CAPACITORS; ELECTRICAL CHARACTERISTICS; PLANARIZATION; SWITCHING NOISE; THERMAL COEFFICIENT OF EXPANSION; THIN FILM CAPACITORS;

MULTICHIP MODULES;

EID: 0029250099     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.365477     Document Type: Article

References (3)

1. K. Genda et al., “Limitation of all transmission velocity in ATM switching equipment with high density mounting technology,” IEICE Technol Rep., SSE 93, pp. 1–6, 1993.
2. T. Siozaki et al., “Accumulating technology of ferroelectric material thin film,” IEICE Technol. Rep., pp. 59–72, 1992.
3. M. Miura et al., “Consideration of switching noise by the calculation of inductance,” IEICE Technol. Rep., ICD 93-153, pp. 45–52, 1993.