Thin multilayer palladium coatings for semiconductor packaging applications part I: solderability

Plating and Surface Finishing

Volumn 82, Issue 2, 1995, Pages 56-62

  Kadija, I V ^a   Abys, J A ^a   Maisano, J J ^a   Kudrak, E J ^a   Shimada, S ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; DISSOLUTION; ELECTRONICS PACKAGING; MULTILAYERS; OXIDATION; PALLADIUM; PALLADIUM ALLOYS; POROSITY; SEMICONDUCTOR DEVICES; SOLDERING; STANDARDS;

PALLADIUM COATINGS; SEMICONDUCTOR PACKAGING; SOLDERABILITY; THIN GOLD FLASH; WIREBONDING;

COATINGS;

EID: 0029247282     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (16)