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Volumn , Issue , 1995, Pages 326-332
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Impact of test structure design on electromigration lifetime measurements
a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRIC CURRENTS;
ELECTRIC LINES;
FAILURE ANALYSIS;
INTEGRATED CIRCUIT TESTING;
METALLIZING;
RELIABILITY;
SEMICONDUCTOR DEVICE MODELS;
SEMICONDUCTOR DEVICE STRUCTURES;
SERVICE LIFE;
DRIFT VELOCITY TYPE FAILURES;
KELVIN TYPE TEST STRUCTURES;
LIFETIME DETERMINATION;
VIAS;
VOLTAGE TAPPING;
ELECTROMIGRATION;
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EID: 0029238074
PISSN: 00999512
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/irps.1995.363716 Document Type: Conference Paper |
Times cited : (13)
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References (15)
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