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Volumn 1, Issue , 1995, Pages 181-184
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High density microwave packaging for T/R modules
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Author keywords
[No Author keywords available]
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Indexed keywords
ARRAYS;
COMPUTER SIMULATION;
ELASTOMERS;
MICROWAVE POWER TRANSMISSION;
RADAR;
RELIABILITY;
SEMICONDUCTING GALLIUM ARSENIDE;
SEMICONDUCTING SILICON;
SUBSTRATES;
THREE DIMENSIONAL;
TRANSCEIVERS;
ALUMINUM NITRIDE;
CONDUCTOR BACKED COPLANAR LINE;
METAL ON ELASTOMER CONNECTOR;
MICROWAVE PACKAGING;
MICROWAVE TRANSMISSION LINE;
SILICON CHIPS;
SOLDERLESS INTERCONNECTS;
TRANSMIT RECEIVE MODULES;
ELECTRONICS PACKAGING;
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EID: 0029231977
PISSN: 0149645X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (0)
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