Reliability and failure mechanism of isotropically conductive adhesives joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1995, Pages 114-120

  Li, Li, ^a   Morris, J E ^a   Liu, Johan ^a   Lai, Zonghe ^a   Ljungkrona, Lars ^a   Li, Changhai ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; CONDUCTIVE MATERIALS; CRACK PROPAGATION; ELECTRIC RESISTANCE; FAILURE (MECHANICAL); PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUIT TESTING; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SURFACE MOUNT TECHNOLOGY; TRANSMISSION ELECTRON MICROSCOPY;

HUMIDITY EXPOSURE; ISOTROPICALLY CONDUCTIVE ADHESIVE JOINTS; MOISTURE PENETRATION;

ADHESIVE JOINTS;

EID: 0029226412     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)