Effect of silicon-containing polyimide on adhesion between glass and polyimide

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 2, Issue , 1995, Pages 2889-2892

  Cho, Kilwon ^a   Lee, Daeho ^a   Seo, Kyung Hoon ^a   Ahn, Tae Oan ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DIMENSIONAL STABILITY; ELECTRONICS PACKAGING; GLASS; MECHANICAL PROPERTIES; MICROELECTRONICS; PACKAGING MATERIALS; PERMITTIVITY; SILICON; THERMODYNAMIC STABILITY;

ADHESION PROMOTER; ADHESION STRENGTH; FEASIBILITY; IMIDIZATION; MULTICHIP PACKAGING;

POLYIMIDES;

EID: 0029223348     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)