Failure mechanism of hole formation in laser welding technique for optoelectronic packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1995, Pages 914-916

  Cheng, W H ^a   Wang, W H ^a   Huang, Y M ^a   Chen, H Y ^a   Lin, H H ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE (MECHANICAL); FIBER OPTICS; LASER BEAM WELDING; MICROSCOPIC EXAMINATION; NEODYMIUM LASERS; OPTOELECTRONIC DEVICES; SHRINKAGE; SOLIDIFICATION;

HOLE FORMATION; OPTOELECTRONIC PACKAGING;

ELECTRONICS PACKAGING;

EID: 0029217810     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)