New approach to using anisotropically conductive adhesives for flip chip assembly

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1995, Pages 107-113

  Lyons, Alan M ^a   Hall, Elizabeth E ^a   Wong, Yiu Huen ^a   Adams, Gregory ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CONDUCTIVE MATERIALS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUIT TESTING; THERMAL EFFECTS;

ANISOTROPICALLY CONDUCTIVE ADHESIVES; FLIP CHIP ASSEMBLY; TEMPERATURE CYCLING;

ADHESIVES;

EID: 0029217678     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)