Modeling electromigration failures in TiN/Al-alloy/TiN interconnects and TiN thin films

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1995, Pages 371-377

  Tao, Jiang ^a   Cheung, N W ^a   Hu, C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ALUMINUM ALLOYS; ELECTRIC WIRING; FAILURE ANALYSIS; MATHEMATICAL MODELS; MULTILAYERS; RELIABILITY; THERMAL EFFECTS; THERMAL GRADIENTS; THIN FILMS; TITANIUM NITRIDE;

BARRIER LAYER; FAILURE MECHANISM; LINE WIDTH; MULTILAYERED INTERCONNECTS; THERMOMIGRATION;

ELECTROMIGRATION;

EID: 0029213597     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/irps.1995.363721     Document Type: Conference Paper

References (12)