Self-aligned machining and assembly of high aspect ratio microparts into silicon

Proceedings of the IEEE Micro Electro Mechanical Systems

Volumn , Issue , 1995, Pages 250-255

  Langen, H H ^a   Masuzawa, T ^a   Fujino, M ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ASSEMBLY; ELECTRIC DISCHARGES; ELECTRIC WIRE; GRINDING (MACHINING); MACHINE COMPONENTS; MICROELECTROMECHANICAL DEVICES; PLATE METAL; SEMICONDUCTING SILICON; THREE DIMENSIONAL; ULTRASONIC APPLICATIONS; VIBRATIONS (MECHANICAL);

HIGH ASPECT RATIO MICROPARTS; MICRO ELECTRODISCHARGE MACHINING; MICRO ULTRASONIC MACHINING; SELF ALIGNED MACHINING; ULTRASONIC VIBRATION; WIRE ELECTRODISCHARGE GRINDING;

MICROMACHINING;

EID: 0029181912     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)